We offer rework-repair and modification services. As our commitment to the electronic industry, we have set-up an ultra modern and fully equipped facilities to cater to our clients ever demanding needs in Printed Circuit Board repairs and rework. All our procedures for modifying, reworking and repairing printed boards and printed board assemblies complies with standards set by the Institute for Interconnecting and Packaging Electronic Circuits (IPC), in Northbrook IL.
 

This procedure is used to replace damaged and missing Ball Grid Array (BGA) pads. The damaged BGA pads are replaced with new dry film, adhesive backed BGA pads. The new BGA pads are bonded to the circuit board surface using a Bonding Iron or Circuit Bonding System.
 

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This procedure is used on circuit boards to replace damaged or missing conductors on the circuit board surface.

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This procedure is used to repair major damage to the edges of circuit base board material. This procedure is used when extended areas of base material must be completely replaced.

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Most types of damage to base board material can be repaired with this versatile repair kit. There are sections of FR4 to replace damaged board corners, edges and holes. The edge sections have a specially machined tongue along one edge to fit within a groove cut into the board edge.

 

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This procedure is used to replace damaged and missing gold edge contacts. The damaged gold contacts are replaced with new dry film, adhesive backed contacts. The new edge contacts are bonded to the circuit board surface using a Bonding Iron or Circuit Bonding System.

 

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